Storage and transportation precautions
The product should be stored in a dry and clean environment with a temperature of -10 ℃~40 ℃ and a relative humidity of 30%~60%. It should be avoided from high temperature and humidity (such as near water sources or air conditioning vents), direct sunlight, corrosive gases (such as hydrogen sulfide and chlorine gas), and dust to prevent oxidation of the pin coating, aging of the plastic shell, and moisture and short circuit of the data transmission pins.
During transportation, anti-static packaging (anti-static shielding bag+anti-static turnover box) should be used. Moisture proof agent should be placed inside the packaging, and "anti-static", "handle with care", and "moisture-proof" signs should be marked on the outside to avoid violent handling that may cause the mother socket shell to break or the pins to bend; After opening the packaging, unused products must be resealed and stored within 48 hours, and prolonged exposure to air is prohibited.
Precautions for installation operation
Before installation, it is necessary to confirm that the size of the PCB board solder pads matches the four pin fully attached pins of the mother base (solder pad error ≤± 0.05mm), and adjust the solder pad layout according to the product specifications to avoid solder joints caused by oversized solder pads and virtual soldering caused by undersized solder pads; When using SMT mounting, strictly control the reflow soldering temperature curve: preheating section 90 ℃~120 ℃ (lasting 60~90 seconds), peak section 250 ℃~260 ℃ (lasting ≤ 10 seconds), cooling section ≤ 50 ℃. Excessive temperature or prolonged high temperature time can cause the plastic shell to soften, the pins to separate from the shell, and affect data transmission performance.
After installation, it is required to pass the double verification of AOI (Automatic Optical Inspection) and data transmission test to confirm that the mother seat is free of tilt (tilt angle ≤ 1 °), the pin is free of offset, and there is no faulty welding/continuous welding. At the same time, it is required to test whether the the third mock examination function (USB 2.0/USB 3.2/PD) is normal. Abnormal products need to be repaired with professional tools, and it is forbidden to enter the next process with defects.
Precautions for use and maintenance
When using, it is necessary to match the corresponding power adapter according to the device requirements, and the input current should not exceed 3A rated value to avoid long-term overload causing pin overheating and burning, plastic shell melting, and affecting the data transmission channel; When plugging and unplugging the TYPE C male connector, it should be operated vertically and steadily, and tilting, rotating, or pulling with force is prohibited to prevent data pin wear from causing transmission lag or interruption (it is recommended to control the plugging and unplugging life within 10000 times).
Regularly check whether there is dust or foreign objects (such as metal debris from data cables) inside the female socket interface. If there are, gently clean them with a dry soft bristled brush. Do not use metal tools (such as tweezers or needles) to enter the interface to prevent scratching the data pins; When repairing the equipment, it is necessary to first disconnect the power supply, and then use professional tools to disassemble the PCB board. It is forbidden to directly bend the mother seat to avoid the four pin pins breaking or the mother seat separating from the PCB board.
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com
