Industry certification

USB-IF certification: Passed USB3.1 GEN2 and USB PD 3.0 certification (TID No.XXXX), supports eMarker cable recognition and dynamic power allocation, compatible with mainstream operating systems (Windows/macOS/Linux).

Security certification:

UL 498 certification (file number EXXXXXX): No breakdown during withstand voltage test at 1500V AC/1min, terminal insulation strength ≥ 500V DC.

IEC 62368-1 compliance: Meets the safety standards for audio and video equipment, with a grounding continuity of ≤ 50m Ω

Environmental certification:

RoHS 2.0/REACH SVHC compliance: lead-free, halogen-free, LCP material recycling rate ≥ 90%.

ISO 14001 Environmental Management System Certification: Production process wastewater/exhaust emissions comply with GB 24694-2009 standard.

Reliability testing

Environmental testing:

Salt spray test: 5% NaCl solution, 48 hours, no corrosion on terminals and clamps (rating ≥ 9).

Temperature cycle: -40 ℃ to 85 ℃, 1000 cycles, contact resistance change ≤ 5%, LCP insulator without cracks.

Mechanical testing:

Vibration test: 10-2000Hz, 20g acceleration, continuous for 2 hours, no cracking of solder joints, signal transmission stability ≥ 99.9%.

Plug and unplug lifespan: Contact resistance ≤ 35m Ω after 10000 cycles, no deformation of clamp plate, in compliance with IEC 61076-3-106 standard.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation specifications

Welding parameters:

Reflow soldering: Temperature 250 ± 5 ℃, preheat 150-200 ℃ for 90-120 seconds to avoid local overheating of LCP insulator (temperature threshold 260 ℃).

Wave soldering: The soldering temperature for harpoon feet is 260 ± 5 ℃, and the time is 3-5 seconds. It is recommended to use silver containing solder (Sn96.5Ag3.0Cu0.5) to improve the toughness of the solder joint.

PCB design:

Clamp pad: width 0.8mm, length 2.0mm, spacing tolerance ± 0.03mm. It is recommended to use ENIG surface treatment (nickel gold thickness ≥ 3 μ m).

Harpoon foot solder pad: with a hole diameter of 0.8mm and a hole spacing of 2.5mm, the grounding pin needs to be connected to a copper covered area of ≥ 20mm ² to enhance heat dissipation and EMI shielding.

Positioning requirements: Use fixtures to ensure that the clamp is perpendicular to the PCB, with a tilt angle of ≤ 1 °, to avoid impedance jumps during signal transmission.

Usage environment

Temperature and humidity range: working temperature -40 ℃ to 85 ℃, storage temperature -50 ℃ to 90 ℃, humidity ≤ 85% RH (no condensation).

Taboo scenario: Long term use in strong acid-base (pH<4 or pH>10), high concentration dust (>200mg/m ³), or strong magnetic field (>100mT) environments is prohibited.

Maintenance suggestions

Regular testing: Signal integrity (insertion loss/return loss) is tested quarterly using a network analyzer, and contact resistance is measured using the 4-wire method (normal ≤ 30m Ω).

Cleaning and maintenance: Use an anhydrous alcohol cotton swab to wipe the surface of the terminal, and prohibit chlorine containing cleaning agents to prevent corrosion of the gold plating layer (corrosion rate ≤ 0.1 μ m/year).

Long term storage: If the mother seat is not installed, it should be sealed in an anti-static bag (humidity ≤ 50%) to avoid deformation of the clamp due to compression. The storage period should be ≤ 2 years.

Compatibility Tips

Protocol matching: It needs to be paired with a main control chip that supports USB3.1 GEN2 (such as TI TUSB4020), and the DisplayPort function requires an external adapter chip (such as Silicon Image SI1702).

Male head selection: Priority should be given to using TYPE C male heads with metal shells (such as USB-IF certified products) to ensure reliable grounding between the shielding layer and the female clamp (contact resistance ≤ 10m Ω).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com