Installation specifications
Welding parameters:
SMT part: Reflow soldering temperature of 250 ± 5 ℃, preheating at 150-200 ℃ for 90-120 seconds.
Pin mounting: Wave soldering temperature 260 ± 5 ℃, soldering time 3-5 seconds, to avoid high temperature damage to LCP insulation.
PCB design:
SMT pad width ≥ 0.6mm, board pin hole diameter 0.8 ± 0.05mm.
It is recommended to connect the grounding pin with ≥ 15mm ² copper cladding to enhance EMI shielding and heat dissipation.
Positioning requirements: Use fixtures to ensure that the female base is installed vertically, with a deviation angle of ≤ 1 °, to avoid pin stress concentration.
Usage environment
Temperature and humidity range: working temperature -40 ℃ to 85 ℃, storage temperature -50 ℃ to 90 ℃, humidity ≤ 85% RH (no condensation).
Taboo scenario: Avoid contact with highly corrosive liquids such as alcohol and solvents, and stay away from areas with strong magnetic fields (>100mT).
Maintenance suggestions
Regular cleaning: wipe the surface of the terminal with anhydrous alcohol every quarter to remove dust and oxides, and prohibit the use of metal tools to scrape the gold plating layer.
Long term storage: Sealed and stored in a dry environment (humidity ≤ 60%), it is recommended to use anti-static bags for packaging, with a storage period of ≤ 2 years.
Compatibility notes
Device matching: It needs to be matched with TYPE C male connectors that comply with the USB-IF standard. Non standard interfaces may cause protocol handshake failure.
Cable selection: It is recommended to use AWG28 cable for data transmission. In fast charging scenarios, it is necessary to pair it with a cable with a carrying capacity of 3A or above to avoid overload.
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com