Installation requirements:
Welding process: The reflow soldering temperature curve is controlled at a preheating section of 150-180 ℃ (60-90 seconds), a holding section of 180-210 ℃ (60 seconds), and a reflow section of 230-255 ℃ (peak value ≤ 255 ℃, holding time 60 seconds). It is recommended to use nitrogen protection (O ₂ content<100ppm) to reduce oxidation.
Positioning accuracy: The tolerance between the four pin SMT pad and the PCB through-hole is ≤ 0.03mm. It is recommended to use a 0.8mm thickness positioning fixture, and after soldering, use 3D AOI to detect the pin offset of ＜ 0.05mm.
Anti static measures: Wear an anti-static wristband (grounding resistance 1-10M Ω) during operation, and lay an anti-static mat (surface resistance 10 ⁶ -10 ⁹ Ω) at the welding station.
Usage restrictions:
Electrical load: Continuous operating current ≤ 3A, instantaneous peak current ≤ 5A (duration ＜ 10ms); When the thickness of PCB copper foil is ≥ 35 μ m (1oz), it is recommended to parallel a 100 μ F/16V electrolytic capacitor (low ESR type) to suppress ripple on the VBUS pin.
Environmental restrictions: Non waterproof models are prohibited from long-term use in environments with humidity greater than 90% RH; Waterproof model (to be customized) requires insulation resistance retesting (>100M Ω) after immersion in water. It is recommended to replace the sealing ring once a year (made of fluororubber material with a Shore hardness of 70 ± 5A).
Compatibility Description:
Protocol adaptation: When connecting with the PD fast charging device, it is necessary to use an external protocol chip (such as IP2721) to achieve the third mock examination fast charging; When connected to USB 3.0 devices, the data rate automatically drops to 480Mbps. It is recommended to use a USB-IF certified A-Micro B cable (AWG28 specification, impedance ≤ 90 Ω).
Device matching: Avoid connecting to non certified docking stations (which may cause abnormal CC pin voltage), recommended compatible chip models: TI TPS2596, Dialog DA9063.
Maintenance suggestion:
Daily cleaning: Clean the interface gap dust with compressed air (0.5MPa) every 2 months in industrial environments, and wipe the stainless steel shell with anhydrous ethanol (purity ≥ 99.5%). It is forbidden to use chlorine containing solvents (such as trichloroethylene).
Storage requirements: Unused mother sockets should be stored in a moisture-proof box (humidity ≤ 40% RH) at a temperature of -20 ℃ to 60 ℃, avoiding storage with strong magnetic field equipment (such as transformers), and preventing the magnetization of brass terminals from affecting conductivity.
Special scenario prompt:
Automotive electronic applications: During in car installation, a thermal conductive silicone sheet (with a thermal conductivity of 1.5W/m · K) should be added between the housing and PCB to avoid local overheating (temperature ≤ 85 ℃) caused by long-term high current operation.
Medical device application: Additional ISO 10993-5 cytotoxicity testing (absorbance ≤ 0.1) is required, 75% medical ethanol should be used for cleaning, and direct UV radiation on the LCP shell is prohibited (which may cause material aging).
For more information, please contact us:
- Hotline: +86 13310802726
- Email: mc13310802726@163.com
