Industry certification

USB-IF certification: Passed USB3.2 GEN2 and USB PD 3.1 certification (TID No.XXXX), supports 240W power transmission and eMarker 2.0 cable recognition, compatible with USB4 v2.0 standard (customization required).

Security certification:

UL 498 certification (file number EXXXXXX): No breakdown during withstand voltage test at 2000V AC/1min, terminal insulation strength ≥ 1000V DC.

IEC 61010-1 compliance: Pollution level 2, overvoltage category III, suitable for industrial safety requirements.

Environmental certification:

RoHS 3.0/REACH SVHC compliance: lead-free, phthalate free, LCP material recovery rate ≥ 95%.

ISO 14001 Environmental Management System Certification: The heavy metal content in production wastewater is ≤ 0.1ppm, which meets the first level standard of GB 8978-1996.

Reliability testing

Environmental testing:

Salt spray test: 5% NaCl solution, 72 hours, no corrosion on terminals and clamps (rating ≥ 9.5).

Temperature cycle: -40 ℃ to 105 ℃, 1000 cycles, contact resistance change ≤ 3%, LCP insulator without cracks.

Mechanical testing:

Vibration test: 10-2000Hz, 25g acceleration, continuous for 2 hours, signal transmission error rate ≤ 10 ^ -12.

Plug and unplug lifespan: Contact resistance ≤ 30m Ω after 15000 cycles, clamp deformation ≤ 0.05mm, in compliance with MIL-DTL-55302E standard.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation specifications

Welding parameters:

Reflow soldering: temperature 255 ± 3 ℃, preheating 180-200 ℃ for 60-90 seconds, using nitrogen protection (oxygen content ≤ 50ppm) to prevent LCP oxidation.

Manual welding: Temperature ≤ 300 ℃, time ≤ 2 seconds, use 0.3mm diameter solder wire (Sn99.3Cu0.7), avoid bridging (bridging rate ≤ 0.1%).

PCB design:

The tolerance for pad spacing is ± 0.005mm. It is recommended to use HDI boards with 12 or more layers, and the impedance control of the signal layer should be ± 5%.

The grounding pin needs to be connected to ≥ 30mm ² copper cladding, and the distance between the power layer and the ground layer should be ≤ 0.2mm to reduce power noise (ripple ≤ 50mV).

Positioning requirement: Use a 0.02mm precision fixture to ensure that the perpendicularity between the clamp and PCB is ≤ 0.5 °, and avoid pin stress concentration at a spacing of 0.7mm.

Usage environment

Temperature and humidity range: working temperature -40 ℃ to 105 ℃, storage temperature -55 ℃ to 125 ℃, humidity ≤ 90% RH (no condensation).

Taboo scenario: Long term use in environments with strong electromagnetic interference (>200mT), high vibration (>30g), or strong corrosion (pH<3 or pH>11) is prohibited.

Maintenance suggestions

Regular testing: Use the 4-wire method to measure contact resistance (normal ≤ 25m Ω) every quarter, and calibrate high-frequency signals through a network analyzer (insertion loss ≤ 25m Ω) -3dB@20GHz ）.

Cleaning and maintenance: Use deionized water (conductivity ≤ 1 μ S/cm) to wipe the terminals, prohibit compressed air dust removal (to prevent electrostatic damage), and perform insulation resistance retesting (≥ 1000M Ω) after cleaning.

Long term storage: The uninstalled mother base should be stored in a nitrogen cabinet (humidity ≤ 20% RH, oxygen content ≤ 1%), with a storage period of ≤ 18 months to prevent oxidation of high-density terminals.

Compatibility Tips

Protocol matching: It needs to be paired with a main control chip that supports USB3.2 GEN2 (such as Renesas RAA77940), and the DisplayPort function requires an external re timer (such as TI DS80CC120).

Male head selection: The same specification 24PIN TYPE C male head (spacing 0.7mm) must be used. Non standard male heads may cause pin deformation or short circuit (compatibility rate<0.01%).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com