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Type-c splint female seat series

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TYPE C female base 24PIN clamp plate 0.8 L=8.8 the third mock examination elastic free brass LCP

This product adopts an ultra short body design, with an overall length of 8.8mm and a clamp plate thickness of 0.8mm, suitable for the space requirements of ultra-thin equipment. The 24PIN structure supports USB3.1 Gen2 (10Gbps), DisplayPort 2.0 (80Gbps), and USB PD 3.1 (140W) the third mock examination protocols, which can synchronously realize high-speed data transmission 8K@60Hz Video output and high-power fast charging. The design without shrapnel is mechanically fixed to the PCB board through metal buckles, avoiding the problem of traditional shrapnel fatigue failure. The terminal is made of high conductivity brass alloy (C26800), with a gold plating of 30 micro inches on the surface and a contact impedance of<30m Ω. The housing is made of LCP liquid crystal polymer material (Sumitomo E5008L from Japan, temperature resistance of 339 ℃, UL 94 V-0 flame retardant), suitable for consumer electronics, industrial control, medical equipment and other scenarios.

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    Industry certification:

    Protocol authentication: Certified by USB-IF (USB3.1 Gen2/PD3.0), VESA (DisplayPort 1.4), HDMI Association (HDCP 2.3).

    Environmental certification: Compliant with RoHS 2011/65/EU (lead-free and halogen-free), ELV standards, LCP recycling rate>90%, brass terminal lead content<0.1%.

    Safety certification: UL 94 V-0 flame retardant, CE/FCC electromagnetic compatibility, IPX7 waterproof through third-party testing, customizable ISO 10993 testing for medical scenarios.

    Industry standards:

    Industrial applications comply with ISO 13849-1 (PLd), while automotive electronics meet the requirements of AEC-Q200 Rev E and ISO 16750-2.

    Quality control:

    Full ERP traceability, conducting salt spray testing (48 hours), thermal cycling (-40 ℃ to 105 ℃, 1000 times), and dynamic contact impedance testing (Δ R<10% after 100000 insertions and removals) for each batch of samples.






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    Installation requirements:

    Welding temperature: Reflow peak ≤ 255 ℃, maintain above 217 ℃ for 60-90 seconds, use high-precision surface mount machine (accuracy ± 0.01mm), Mark point assisted alignment, 3D AOI check pin offset<0.03mm.

    Positioning accuracy: The PCB pad tolerance needs to be controlled with a spacing of 0.5mm. It is recommended to design positioning columns (diameter 1.0mm, height 2.0mm) to enhance stability.

    Usage restrictions:

    Non waterproof models are prohibited from humid environments, while waterproof models require regular inspection of the sealing ring (fluororubber, replacement cycle 1-2 years).

    When applying high current, the thickness of the PCB copper foil should be ≥ 50 μ m, and a 100nF ceramic capacitor (X7R) should be connected in parallel with the VBUS pin to suppress ripple and avoid overheating.

    Compatibility Description:

    The the third mock examination protocol requires device side chip support (such as TI TUSB8041). It is recommended to use USB-IF certified EMarker cable (such as USB4 Gen3).

    Maintenance suggestion:

    Clean interface dust with compressed air every quarter in industrial environments, wipe medical equipment with 75% ethanol, and prohibit chlorine containing disinfectants.

    When idle for a long time, use LCP dust cover to protect the interface, store at a temperature of -20 ℃ to 60 ℃, humidity ≤ 60% RH, and prevent oxidation of brass terminals.






    For more information, please contact us:


    - Hotline: +86 13310802726


    - Email: mc13310802726@163.com


    If you have any special requirements or questions that require prior consultation. Please fill out the following form and we will have the specialist contact you as soon as possible.