Industry certification:

Protocol authentication: Certified by USB-IF (USB3.1 Gen2/PD3.0), VESA (DisplayPort 1.4), and HDMI Association (HDCP 2.3) to ensure compatibility with mainstream devices.

Environmental certification: Compliant with RoHS 2011/65/EU (lead-free, halogen-free), ELV 2000/53/EC standards, LCP material recycling rate>90%, brass terminal lead content<0.1%.

Safety certification: UL 94 V-0 flame retardant rating, CE/FCC electromagnetic compatibility certification, IPX7 waterproof tested by third-party laboratories, customizable ISO 10993 cytotoxicity testing for medical scenarios.

Industry standards:

Industrial applications comply with ISO 13849-1 (PLd) mechanical safety standards, while automotive electronics meet AEC-Q200 Rev E (vibration, temperature cycling) and ISO 16750-2 (electrical loads) requirements.

Quality control:

The entire production process is traced through the ERP system, and each batch is sampled for salt spray testing (48 hours, 5% NaCl), thermal cycling testing (-40 ℃ to 105 ℃, 1000 times), and contact impedance dynamic testing (Δ R<10% after 100000 insertions and removals).

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com

Installation requirements:

Welding temperature control: Reflow peak temperature ≤ 255 ℃, holding time above 217 ℃ for 60-90 seconds. It is recommended to use nitrogen shielded welding (O2 content<100ppm) to avoid oxidation and discoloration of LCP shell.

Positioning accuracy: A high-precision surface mount machine (accuracy ± 0.01mm) is required for ultra short spacing of 0.5mm. It is recommended to design Mark points to assist in alignment, and use 3D AOI to check the pin offset of less than 0.03mm after welding.

Usage restrictions:

Non waterproof models are prohibited from being exposed to humid environments. Waterproof models need to check the sealing ring (made of fluororubber material, recommended replacement cycle of 1-2 years) after long-term use.

When applying high current, it is necessary to ensure that the thickness of the PCB copper foil is ≥ 50 μ m (1.4oz), and it is recommended to parallel 100nF ceramic capacitors (X7R material) to suppress ripple and avoid overheating for the VBUS pin.

Compatibility Description:

The third mock examination protocol requires device side chip support (such as TI TUSB8041, Intel JHL8040). It is recommended to indicate the list of compatible chips in the product specification; Non certified cables may cause PD protocol handshake failure. It is recommended to use EMarker cables with USB-IF certification (such as USB4 Gen3 cables).

Maintenance suggestion:

It is recommended to clean the interface dust with compressed air (0.5MPa) every quarter in industrial environments to avoid short circuits caused by foreign objects between pins with a spacing of 0.5mm; After using medical equipment, the casing can be wiped with 75% ethanol, and the use of chlorine containing disinfectants is prohibited.

When idle for a long time, a dust cover (LCP material) should be used to protect the interface. The storage environment temperature should be between -20 ℃ and 60 ℃, and the humidity should be ≤ 60% RH to prevent oxidation of the brass terminals.

For more information, please contact us:

- Hotline: +86 13310802726

- Email: mc13310802726@163.com